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Package more information

COF

Structure

Packages where traces are formed on a flexible tape using photolithograph technology and a semiconductor chip is mounted on the tape carrier using TAB

( Tape Automated Bonding ) technique.

Material thickness has been reduced to allow supply of COF packages which support fine pitches.

Appealing Points

  • Patterning is applied to a tape substrate using thin copper foil, pin formation of 40µm and that of 35µm or less are possible for COF ( Chip On Film ) , respectively.
  • The package thickness can be reduced to 1mm or less since IC chips are mounted directly on a tape substrate.
  • COF can be freely fold-mounted except its plastic sealed section.